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  • Integrated Systems and Circuits Design

    Master of Science in Engineering
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Curriculum - Integrated Systems and Circuits Design

Course number Lecture Type SPPS ECTS-Credits
M-ISCD-1.06 Basics in Systems and Circuits Theory ILV 2,0 2,5
M-ISCD-1.04 Design of Analog Integrated Circuits ILV 5,0 7,5
M-ISCD-1.02 Design of Digital Integrated Circuits ILV 4,0 6,0
M-ISCD-1.03 Integrated Circuits Technology ILV 2,0 3,0
M-ISCD-1.01 Introduction to Computer Aided Design ILV 4,0 6,0
M-ISCD-1.05 Introduction to Project PT 2,0 3,0
Sum 19,0 28,0
Compulsory optional subject: Foreign Language 1 Type SPPS ECTS-Credits
M-ISCD-1.07c German 1 SE 2,0 2,0
M-ISCD-1.07b Italian 1 SE 2,0 2,0
M-ISCD-1.07a Spanish 1 SE 2,0 2,0
Sum 2,0 2,0
Course number Lecture Type SPPS ECTS-Credits
M-ISCD-2.01 Advanced Topics in Analog Integrated Circuits ILV 5,0 7,5
M-ISCD-2.03 Computer Aided Design ILV 2,0 3,0
M-ISCD-2.04 Digital Design with HDL ILV 5,0 7,5
M-ISCD-2.05 IC Design and Implementation PT 4,0 5,5
M-ISCD-2.02 System Modeling and Verification - Digital ILV 3,0 4,5
Sum 19,0 28,0
Compulsory optional subject: Foreign Language 2 Type SPPS ECTS-Credits
M-ISCD-2.06c German SE 2,0 2,0
M-ISCD-2.06b Italian SE 2,0 2,0
M-ISCD-2.06a Spanish SE 2,0 2,0
Sum 2,0 2,0
Course number Lecture Type SPPS ECTS-Credits
M-ISCD-3.02 IC Evaluation PT 1,5 2,5
M-ISCD-3.07 System Modeling and Verification - Analog ILV 2,0 3,0
M-ISCD-3.01 Testing of Integrated Circuits ILV 3,5 4,5
Sum 7,0 10,0
Compulsory optional subject: Elective Courses 1 Type SPPS ECTS-Credits
M-ISCD-3.03 Analog and Mixed Signal ICs for Communication Systems ILV 3,5 5,0
M-ISCD-3.05 Integrated Data Converters ILV 3,5 5,0
M-ISCD-3.06 Special Topics in VLSI/SoC/SiP Design - 1 ILV 3,5 5,0
M-ISCD-3.04 System-on-Chip Architectures ILV 3,5 5,0
Sum 7,0 10,0
Compulsory optional subject: Elective Courses 2 Type SPPS ECTS-Credits
M-ISCD-3.08 Advanced Topics in Digital Integrated Circuits ILV 3,5 5,0
M-ISCD-3.10 Arithmetic Modules for VLSI/SoC Design ILV 3,5 5,0
M-ISCD-3.09 Integrated Sensors for Automotive Applications ILV 3,5 5,0
M-ISCD-3.12 Smart Power ILV 3,5 5,0
M-ISCD-3.11 Special Topics in VLSI/SoC/SiP Design - 2 ILV 3,5 5,0
Sum 7,0 10,0
Course number Lecture Type SPPS ECTS-Credits
M-ISCD-4.01 Master Thesis MT 0,0 24,0
M-ISCD-4.02 Master Thesis - Seminar ILV 4,0 6,0
Sum 4,0 30,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-1.01 CAD Tools ILV 7,0 10,0
ISCD-1.02 Design of Analog Integrated Circuits ILV 5,0 7,5
ISCD-1.03 Design of Digital Integrated Circuits ILV 5,0 7,5
ISCD-1.05e Französisch 3 SE 4,0 4,0
ISCD-1.05a German 1 SE 2,0 2,0
ISCD-1.04 Integrated Circuits Technology ILV 2,0 3,0
ISCD-1.05c Italian 1 SE 2,0 2,0
ISCD-1.05d Slovene 1 SE 2,0 2,0
ISCD-1.05b Spanish 1 SE 2,0 2,0
Sum 31,0 40,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-2.01 Advanced Topics in Analog Integrated Circuits ILV 5,0 7,5
ISCD-2.03 Digital Design with HDL ILV 5,0 7,5
ISCD-2.05 Foreign Language 2 SE 2,0 2,0
ISCD-2.05e French 4 ILV 2,0 2,0
ISCD-2.05a German 2 SE 2,0 2,0
ISCD-2.05c Italian 2 SE 2,0 2,0
ISCD-2.05d Slovene 2 SE 2,0 2,0
ISCD-2.05b Spanish 2 SE 2,0 2,0
ISCD-2.02 System Modeling and Verification ILV 5,0 7,5
ISCD-2.04 Testing of Integrated Circuits ILV 4,0 5,5
Sum 31,0 40,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-3.01 Advanced Topics in Digital Integrated Circuits ILV 5,0 7,5
ISCD-3.07 Arithmetic Modules For VLSI/SoC Design ILV 5,0 7,5
ISCD-3.02 Design Of High Performance Analog And Mixed-Signal Integrated Circuits ILV 5,0 7,5
ISCD-3.13 German 3 SE 2,0 2,0
ISCD-3.04 Integrated Data Converters ILV 5,0 7,5
ISCD-3.05 Integrated Sensors For Automotive Applications ILV 5,0 7,5
ISCD-3.06 Mixed-Signal Design for Communication Systems ILV 5,0 7,5
ISCD-3.14 Optional Subject ILV 1,5 3,0
ISCD-3.14a Optional Subject, Integrated & Discrete Power Electronics ILV 1,5 3,0
ISCD-3.11 Slovene 3 UE 4,0 4,0
ISCD-3.08a Smart Power (Special Topics In VLSI/SoC/SiP Design 1) ILV 5,0 7,5
ISCD-3.08 Special Topics In VLSI/SoC/SiP Design 1 ILV 5,0 7,5
ISCD-3.09 Special Topics In VLSI/SoC/SiP Design 2 ILV 5,0 7,5
ISCD-3.03 System-on-Chip Architectures ILV 5,0 7,5
Sum 59,0 87,0
Optional subject Type SPPS ECTS-Credits
ISCD-3.10 Italian M3 SE 2,0 0,0
ISCD-3.12 Spanish M3 SE 2,0 0,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-4.01 Master Thesis Seminar SE 4,0 6,0
ISCD-4.05 Slovene 4 UE 4,0 4,0
Sum 8,0 10,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-1.01 CAD Tools ILV 7,0 10,5
ISCD-1.02 Design of Analog Integrated Circuits ILV 5,0 7,5
ISCD-1.03 Design of Digital Integrated Circuits ILV 5,0 7,5
ISCD-1.04 Fabrication and Packaging Technology ILV 3,0 4,5
ISCD-1.05 Italian 1 SE 2,0 2,0
ISCD-1.06 Spanish 1 SE 2,0 2,0
Sum 24,0 34,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-2.01 Advanced Topics In Analog Integrated Circuits ILV 5,0 7,5
ISCD-2.05 Italian 2 SE 2,0 2,0
ISCD-2.06 Spanish 2 SE 2,0 2,0
ISCD-2.02 System Modeling and Verification ILV 6,0 9,0
ISCD-2.03 System-On-Chip Architectures ILV 5,0 7,5
ISCD-2.04 Test of Integrated Circuits ILV 4,0 6,0
Sum 24,0 34,0
Course number Lecture Type SPPS ECTS-Credits
ISCD-3.01 Advanced Topics In Digital Integrated Circuits ILV 5,0 7,5
ISCD-3.07 Arithmetic Modules For VLSI/SoC Design ILV 5,0 7,5
ISCD-3.02 Design Of High Performance Analog And Mixed-Signal Integrated Circuits ILV 5,0 7,5
ISCD-3.03 Digital Design With HDL ILV 5,0 7,5
ISCD-3.04 Integrated Data Converters ILV 5,0 7,5
ISCD-3.05 Integrated Sensors for Automotive Applications ILV 5,0 7,5
ISCD-3.10 Italian 3 SE 2,0 2,0
ISCD-3.06 Mixed-Signal Design For Communication Systems ILV 5,0 7,5
ISCD-3.11 Spanish 3 SE 2,0 2,0
ISCD-3.08 Special Topics In VLSI/SoC/SiP Design 1 ILV 5,0 7,5
ISCD-3.09 Special Topics In VLSI/SoC/SiP Design 2 ILV 5,0 7,5
Sum 49,0 71,5
Course number Lecture Type SPPS ECTS-Credits
ISCD-4.02 Master Thesis SE 20,0 24,0
ISCD-4.01 Master Thesis Seminar SE 4,0 6,0
Sum 24,0 30,0

Information

When the first planar integrated circuit was fabricated in 1961, combining 2 transistors on a common substrate, it was hardly imaginable that within little over 50 years it would be possible to integrate a billion transistors on a single chip. This dramatic evolution in semiconductor fabrication technology has followed Moor’s law, who predicted this exponential growth as soon as 1965. This exponential growth is still expected to continue, providing new application opportunities. However, the design of these new applications provides new challenges to the development of such systems on chip. Problems, created due to feature sizes below 100nm, design complexity, growing software content in integrated circuits, power consumption, on-chip communications and interconnects, radio frequencies as well as high resolution analogue interfaces in ‘noisy’ digital environment, just to name a few, need to be solved in always shorter time to market. For all this, industry needs design engineers who master both the complexity of integrated systems and have a broad understanding in technology and devices.

The international graduate curriculum Integrated Systems and Circuits Design was developed in a cooperation of academic and industry experts and will address all challenges of the design of integrated systems and circuis.

The objective is to generate special skills in the following three areas:

  • System Solutions

    • System and VLSI architectures
    • Embedded systems
    • SoC – system on chip
    • SiP – system in package
    • Modeling 

  •  Integration

    • Fabrication technology
    • Analog and digital VDSM-circuit design
    • Sensors and power electronics 

  •  Design methodology

    • Use of modern CAD tools
    • Modeling and verification
    • HDLs – hardware description languages

In these working areas chip designers often concentrate on the development of analog or digital components, which are also frequently used in mixed-signal integrated circuits. While many designers worldwide specialize on the design of purely digital components, Austrian microelectronic companies employ many experts for analog and mixed-signal integrated circuit design. 

Therefore the ISCD curriculum offers 2 semesters of mandatory courses and allows specialization in the more analog or digitally dominated domain through elective courses in semester 3 and a thesis work which is accompanied by seminars with presentations and technical discussions, in semester 4.

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